Continue With Google
continue with facebook
Kigen Showcases NuvoLinQ in eSIM Innovation Feature on MFF4 and SGP.32
NuvoLinQ is excited to be featured in Kigen’s latest blog on the future of eSIM hardware, spotlighting the next-generation MFF4 form factor and its role in powering secure, compact, and scalable IoT solutions.
As the world’s smallest solderable eSIM, MFF4 unlocks massive design flexibility for modern IoT applications—from payment terminals to asset tracking to connected industrial systems.
In the article, Kigen highlights how NuvoLinQ’s LinQ1Zero platform is already enabling seamless SGP.32-compliant connectivity in real-world deployments.
Read the full blog from Kigen.
This collaboration continues to showcase how hardware innovation + intelligent network orchestration = scalable, future-proof IoT deployments.